Introduction
This proposal aims to acquire a fully automated 300-mm wafer electrical probe station to enhance the testing and characterization capabilities of the department. The proposed probe station will include advanced features such as: Compatibility with 300-mm wafers, High-resolution motorized stages for precise positioning and alignment, Integrated thermal chuck for temperature-dependent measurements ranging from -60°C to 300°C, Fully shielded and low-leakage measurement environment for ultra-low current and voltage testing, Seamless integration with semiconductor parameter analyzers for automated measurements, User-friendly software interface for programmable measurement workflows, Optical and imaging systems for accurate alignment and defect inspection.
Estimated Timeline for the Project
12 months
- 8 months for Acquisition and
- 4 months for Installation and testing.
Expected Impact
The department currently relies on manual mini probe-stations, which limits throughput and measurement precision. Additionally, it hinders us to have industrial collaboration as the industry standard is 300-mm wafers, where reliability and multi-device analysis demand an automated system.
The acquisition of this automated probe station will enable cutting-edge industrially relevant research on advanced semiconductor devices with significantly reduce measurement times and improve data accuracy. This equipment aligns with global industry standards and will attract collaborative projects with semiconductor companies. The proposed system will serve as a vital tool for training students and researchers in advanced device characterization techniques. This will lead to strengthened reputation of the department and the institute as a hub for advanced semiconductor research.
